ã€China Aluminum Industry Network】ã€Technical Overview】 ã€Features】 Circular Saw,Miter Saw,Angle Grinder,Drill Press Ningbo Hoya Electronic Commerce Co., LTD , https://www.jauhitools.com
Nippon Wireless has focused on soldering technology in semiconductor packaging technology and has conducted long-term research and development to replace conventional wire bonding materials with aluminum using copper wire.
In general, wire bonding directly to the aluminum chip of a semiconductor chip using a copper wire is highly technical, and it is difficult to realize mass production.
This time, with the help of equipment and materials manufacturers*2, New Japan Wireless used thermal wedge welding technology*3 to successfully realize the use of thick copper wire with a wire diameter of 200 μm or more and wire directly on the aluminum electrode of a semiconductor chip. Welded and first set production technology. 
1. The thermal cycle test has achieved more than 5,000 temperature cycles, ensuring the high reliability of the product. In industrial equipment and electric vehicles, etc., they are required to ensure the operating characteristics at high temperatures and to have a longer thermal cycle test*4 life.
The company's thermal cycle test results show that the aluminum wire can achieve about 2,000 thermal cycle life, while the copper wire can achieve more than 5,000 thermal cycle life.
2. Reducing the use of wood helps reduce the burden on the environment. Compared with aluminum wires, copper wires have higher fusing currents, and the use of copper wires with a wire diameter of 200 μm can achieve equivalent characteristics of aluminum wires with a wire diameter of 300 μm. Therefore, the use of materials reduces and the environmental burden decreases. It has also been alleviated.
In addition, the thermal conductivity of aluminum is 238 W/mK, and the thermal conductivity of copper is 397 W/mK higher than that of aluminum. The good thermal conductivity of copper can also be applied to low-loss technologies.
[Future progress]
In the future, Nippon Wireless will apply this technology to high-power devices such as SiC-SBD and actively develop product development.
*1: Wire bonding mass production technology using thick copper wire and aluminum electrodes with a wire diameter of 200 μm or more (Company's survey results in May 2012)
*2: Equipment manufacturer: Ultrasonic Industry Co., Ltd. (REBO7-WC), material manufacturer: Tanaka Electronics Industry (CHA)
*3: It is a method of wire bonding. It does not form a spherical metal droplet at the end of the wire, and it is directly welded to the electrode by means of ultrasonic waves or heating.
*4: Tests are repeated to change the ambient temperature to confirm that the semiconductor product is not damaged or fails.
Heavy-duty copper wire and aluminum electrodes for mass production of wire bonds for the first time